Etch Process Engineer E3S

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

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You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Key Responsibilities

• Design, execute, collect, analyze, and document routine to moderately complex plasma etch process experiments in compliance with safety guidelines.
• Support investigation of etch process challenges and contribute to developing experimental plans for process improvement activities (e.g., profile control, selectivity, CD, defectivity, uniformity).
• Perform etch chamber hardware and process characterization under the guidance of senior engineers, including evaluation of hardware components such as ESCs, rings, liners, gas delivery systems, and RF subsystems.
• Troubleshoot routine process issues, perform root cause analysis, and implement corrective actions with guidance from experienced engineers.
• Measure and analyze thin-film and post-etch material properties using standard metrology techniques and established methodologies.
• Translate engineering requirements into process experiments and support development of practical process solutions.
• Collaborate with hardware, mechanical, manufacturing, COE, and customer-facing teams to understand interactions between process conditions, chamber hardware, and device performance.
• Prepare technical reports, experiment summaries, presentations, and engineering documentation to communicate findings and recommendations.
• Support qualification and introduction of new etch processes, chamber hardware, materials, and recipes into development and production environments.

Required Technical Skills & Knowledge

• Fundamental understanding of plasma etch processes, including plasma chemistry, surface interactions, and process parameter relationships.
• Working knowledge of etch chamber subsystems and key process controls, including RF power, gas delivery, pressure, temperature, and hardware configuration.
• Familiarity with thin-film materials and characterization techniques such as SEM, XRD, XPS, and post-etch analysis.
• Basic proficiency in Design of Experiments (DOE), statistical analysis, and process data interpretation.
• Ability to evaluate process data and identify relationships between hardware configuration, process performance, and wafer results.
• Strong problem-solving, analytical, and communication skills.

Scope & Autonomy (E3s Level)

• Works under general supervision while performing routine to moderately complex engineering assignments.
• Executes established engineering procedures and contributes to process development activities.
• Escalates complex technical issues appropriately and seeks guidance when required.
• Supports project objectives and process development efforts within an assigned area of responsibility.
• Collaborates effectively with cross-functional teams to achieve engineering and business goals.

Education & Experience

• Master’s degree (or foreign equivalent) in Materials Science, Chemistry, Physics, Chemical Engineering, Electrical Engineering, or a related field, plus relevant semiconductor process engineering experience.
• Typically, 2-5 years of semiconductor process engineering experience, preferably in plasma etch.
• Experience with semiconductor process development, characterization, or manufacturing environments is preferred.
• Equivalent combinations of education and experience may be considered, consistent with the AMAT Global Career Framework.

Additional Information

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Relocation Eligible:

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.