Hybrid Bonding Technology Process Development Engineer (Entry-level)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

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You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

The Advanced Packaging Development Center (APDC) is a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding. APDC was established as a joint lab partnership with the Institute of Microelectronics (IME), a research institute of Singapore’s Agency for Science, Technology and Research (A*STAR).

We are currently seeking for a passionate new graduate to join us on exciting hybrid bonding technology development!

Key Responsibilities

• Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications.

• Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking. Proactively initiate and conduct CnF tests to define process & hardware requirements.

• Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM.

• Deep dive with engineering team and/ or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements.

• Evaluate proto chamber for hybrid bonding process for HBM. Own process optimization and drive engineering improvement.

• Guide account/field teams on tough technical issues.

Opportunities

• On-job training on CoW hybrid bonding processes and challenges. Hands-on on the state-of-the-art integrated hybrid bonder.

• Hands-on exposure on state-of-the-art metrologies.

• Technical training on/ exposure to up & downstream integration processes and interaction with hybrid bonding.

• Witness and contribute to the historical industrial inflection from micro-bump to hybrid bonding. See your innovations become real to enable high-performance AI and server chips.

• Flexible working hours

Requirements

• Engineering or science university educational background.

• Academic background on plasma, wet clean, and/or thermal module is a big plus.

• Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus.

• 10% travel commitment to the US, Taiwan, Korea or Europe.

Working Location

• Science Park II (Moving to Tampines end of 2026)

Additional Information

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Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.