Module Process Engineer (Advanced Packaging)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

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This Module Processengineerwill support the setup and ramp of our next-generation semiconductor Nanospace.

Roles & Responsibilities

• Own process qualification for newly installed tool(s) (e.g., Bonding, Etch, CVD/PVD, CMP, Plating, etc.) to support Nano Space and P4.0 startup.

• Collaborate with APG and factory teams to set up MES/RMS and pre-production line for successful ramp-up.

• Sustain and optimize assigned process modules for internal test vehicle builds supporting heterogeneous integration.

• Monitor tool performance, yield, and defectivity; drive corrective actions.

• Partner with Business Units (BU) to enable key customer projects and technology transfers.

• Execute DOE for recipe development and process optimization to improve cost, cycle time, and quality.

• Apply model-based problem solving and root cause analysis for excursions; implement preventive measures.

• Work closely with integration, BU, and operations teams to meet startup and ramp objectives.

• Maintain process specifications, FMEA, and train technicians/associates for operational readiness.

Requirements

• PhD/ Master/ Bachelor in Materials Science, Chemical Engineering, Electrical Engineering or related studies

• 3 years and above of process-related experiences in semiconductor industry

• Strong knowledge of semiconductor processes (e.g., Etch, CMP, CVD/PVD, Plating, Bonding, etc).

• Experience in process qualification and startup for advanced packaging or front-end modules.

• Proficiency in DOE, SPC, and data analysis tools.

• Demonstrated ability in conceptual and practical problem solving.

• Strong communication, collaboration, and ability to thrive in a fast-paced startup environment.

Work Location

• Science Park II (Moving to Tampines in end 2026)

Additional Information

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Relocation Eligible:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.