Senior Engineer, Failure Analysis

We are seeking a highly skilled Senior Failure Analysis Engineer to join our semiconductor engineering team. In this role, you will be responsible for identifying, analyzing, and resolving failures in semiconductor devices, providing root cause analysis (RCA), and driving corrective actions to improve product reliability.

Key Responsibilities:

• Lead electrical, physical, and material failure analysis on semiconductor components (e.g., ICs, wafers, packages).
• Perform root cause analysis using various analytical techniques (e.g., SEM, FIB, TEM, EDX, X-ray, OBIRCH, TLP, curve tracing, decapsulation).
• Provides Electrical and Physical failure isolation analysis support to localize failure defect and determine root cause of failure in silicon devices
• Drive continuous improvement in quality, productivity, cost and safety of work processes and environment to achieve assigned section/department and/or company KPI.
• Collaborate with design, product, reliability, and process engineering teams to evaluate failures and recommend corrective actions.
• Prepare detailed failure analysis reports and present findings to internal stakeholders and customers.
• Support new product introduction (NPI) by identifying potential failure modes during qualification.
• Manage lab equipment operation and maintenance, and ensure proper calibration and usage.
• Drive continuous improvement of failure analysis processes and methodologies.
• Formulate concise failure analysis reports and responsible in failure analysis results presentation to stakeholders

Required Qualifications

• Requires a Bachelor Degree or Master in Engineering (Electrical &/or Electronics, Microelectronics, Physics, Material Sciences, Chemical)
• Good Understanding in Semiconductor fundamentals, process flow, transistor device physics and circuit design and analysis are highly valued.
• Familiar with failure mode and effects analysis (FMEA) 
• Established in hands-on EFA skillsets to perform Electrical fault isolation using laser induced techniques, photon emission and thermal microscopy with good understanding on techniques strength and limitation
• Established in hands-on PFA skillsets to perform Physical Failure analysis methods including mechanical polishing/delayering, SEM inspection, FIB analysis and chemical etch procedures, for sample preparation and defect viewing
• Experience on operating lab electronic instruments, ie Parametric Analyzers, are highly valued.
• Works on improvement projects, take on tool ownership responsibilities and documentation of SOPs and specifications
• Motivated, Committed, Works well in teams, possess good communication skills